GB-P20 Removal of External Semiconducting Layer

·Cable diameter 10-52mm
Features:
·Outer semiconductor cutting thickness adjustment (A), fine tuned with a precision of 0.1mm spacing, with a maximum thickness of 1.2mm and 5 selectable scales.
·The cutting blade angle provides 5 settings: 0=radial ring cutting/1=smaller angle/2-5>for larger cable sections.
·The residual material after cutting can be smoothly wrapped around the cable using a specially designed binding hook (C) without affecting the continuous cutting operation.
·The clamp protective cover with grooves (GB-M20-S9/R) can maintain stable feed spacing during rotation.
·Silicone oil grease must be applied to the outer semiconductor to increase its lubrication effect